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10th IEEE INTERNATIONAL TEST CONFERENCE INDIA 2026

JULY 19-21, 2026 | RADISSON BLU, MARATHAHALLI, BENGALURU

ACADEMIA RESEARCH TRACK

International Test Conference, the world’s premier venue dedicated to the electronic test of devices, boards and systems, will host a dedicated Academia Research Track (ART) to manifest creative research ideas from students and young academicians. The key objective of this academia track, first time planned to be held with the International Test Conference, is to provide a dedicated informal forum for vigorous creative discussion and debate of this area from researchers of various academic institutes. The aim is to encourage the oral/poster presentation with discussion on truly innovative and “out-of-the-box” ideas that may not yet have been fully developed for presentation at reviewed conferences to address these challenges.

Students and young academicians are invited to submit original and high quality research work or innovative idea to this track. Selected ideas will interact with dedicated panel from industry to further extended the research work of common interests. ART is a platform of presenting late-breaking ideas, getting feedback on an innovative method, or participating without having to write a full paper.

Submission Guidelines

  • One or two topic(s) from the topic list, or a description of your topic.
  • An abstract of 100 words or less to be entered online.
  • An electronic copy of the paper up to 3 pages or an extended summary up to 4 pages, double-columned in IEEE Format (Paper template).
  • Your submission must include the problem statement and novelty of solution(s). It should not include information that serves to identify the authors of the manuscript, such as name(s) or affiliation(s) of the author(s). References and bibliographic citations to the author(s) own published works or affiliations should be made in the third person.

Selection Criteria

  • Abstracts will be selected based on the novelty of the work and its relevance to the conference. The selected abstracts would be later either categorized into poster presentation or oral presentation, solely based on the merit.
  • Upon receiving the acceptance notification, the author will be informed if the paper is classified as a regular full paper or a poster.
  • If the submission got accepted under full paper category, it will be considered for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Additional Benefits

  • Registration fee waiver and partial or full travel support will be provided through fellowship.
  • Long term research plan with industry, if research interests align.
  • High Impact Research award will be presented in conference banquet.

Topics of Interest

Include (not limited to):

  • RF, mm-Wave and THz Testing
  • Embedded BIST & DFT
  • 3D/2.5D Test
  • Emerging Defect Mechanisms
  • Adaptive Test in Practice
  • Hardware Security and Trust
  • ATE/Probe Card Design
  • Known-Good-Die testing
  • Advances in Boundary Scan
  • Memory Test and Repair
  • Data Driven Methods
  • MEMS Testing
  • Data Exchange and Infrastructure
  • Mixed-Signal and Analog Test
  • Defect-Oriented Testing
  • New Technologies and Test
  • DFM and Test Diagnosis
  • On-Chip Test Compression
  • Economics of Test
  • Online Test
  • End-to-End Data Analysis
  • Pre- and Post-Silicon Validation
  • Bring Up
  • System Test (Applications)
  • Power Issues in Test
  • System Test (Hardware/Software)
  • Protocol-aware Test
  • Test-to-Design Feedback
  • Reliability and Resilience
  • Test Escape Analysis
  • Scan Based Test
  • SoC/SiP/NoC Test
  • Silicon Debug
  • IoT Testing
  • Simulation and Test
  • Jitter, High-Speed I/O and RF Test
  • Test Flow Optimizations
  • Test Generation and Validation
  • Test Resource Partitioning
  • Test Standards
  • Test Time Analysis and Reduction
  • Testing High Speed Optics/Photonics
  • Yield Analysis and Optimization

Submit Research

Share your innovative ideas and research with the community.

Need Help?

For questions regarding the program or submission process, please contact us.